![]() The chips may be attached by various manufacturing techniques, including: wire bonding, tape automated bonding (TAB), and flip-chip bonding. This level pertains to the attachment of the IC chip to the lead frame of the various types of chip carriers. Level 1: Interconnections From the Chip to the Package The functionality of these chip devices has increased exponentially over the last decade or two. These connections are all permanent and are formed during IC fabrication. This is a device-level interconnect that consists of integrating various elements such as resistors, transistors, capacitors, etc., on an individual chip. Experts associated with building or facility wiring architectures believe that there are seven commonly recognized levels. However, as the connectivity leaves the internal equipment and enters the building wiring environment, additional levels may be identified. There is little disagreement about the lower levels of interconnection, Levels 0 to 4. Therefore, selecting the most appropriate product to reliably serve this interconnection function is critical to the utility of the equipment. At every interconnection point, at every level, there is a potential for failure, regardless of whether the connection is a permanent or a separable one. There are various Levels of Interconnection (LOI) in the electrical connector packaging field. Updated: November 27th, 2017 When we integrate electronics into building and architecture environments, the number of connection points is no longer limited to the confines of a product package.īy William Garver, APEX Electrical Connector Consultants LLC ![]()
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